 
KINGDA-GOPCBA is a professional PCB manufacturing，SMT,DIP,PCB Assembly manufacturer in China.
As a turnkey Electronic Manufacturing Services factory,GOPCBA focus on provide excellent product quality and professional service for client,The fields include industrial control, medical electronics,automotive electronics,consumer electronics, LED lighting,smart home applications,etc.All of the equipment adopts the world's top brands to provide customers with high-quality products.
The professional team of designers and engineers make our product technology at the world's leading level.
GOPCBA has a very strict quality control system,equipped with AOI,XRAY,SPI,intelligent first tester.QC inspect every process of production.and the QA report before shipment and strict control for each production ensure high quality.
With the enterprise spirit "Efficient ,Pragmatic,Innovative,Beyond" ,GOPCBA strives to become a world-class technical services company
KINGDA SOLUTIONS
PCB Layout Design
10 years of PCB layout design experience
Rigorous design and review process
LIB, SI, EMC, RF, Base Band professional division
One version succeed，reduce the cost of R&D，shorten the time to market
PCB manufacturing
Quick quote, Fast delivery
TPS Quality control system
HDI PCB board service
100% flying probe test
PCB Assembly
Reliable quality Stability delivery
Competitive price
Turnkey solution service
on-time delivery rate 98.8%
Factory view
1000㎡ perday PCB production capability
GOPCBA has the ability to build 2-64 layer multilayer board designs produced and Mass production, High Performance Materials, Buried Capacitance, Hybrid Applications, Buried Resistors. HDI.
10million point perday SMT production capability
GOPCBA have 6 high-speed production line，2 DIP line and 2 box build line. And equipped with AOI, XRAY, SPI, intelligent first tester
PCB Manufacturing Capability
| NO |
Ite |
Craft Capacity |
1
|
Layer |
2-64Layers |
| 2 |
Base Material for PCB |
FR4, CEM-1,TACONIC, Aluminium, High Tg Material, High frequency ROGERS ,TEFLON, ARLON, Halogen-free Material |
| 3 |
Rang of finish baords Thickness |
0.21-7.0mm |
| 4 |
Max size of finish board |
900MM*900MM |
| 5 |
Minimum Line width
|
3mil (0.075mm) |
| 6 |
Minimum Line space |
3mil (0.075mm) |
| 7 |
Min space between pad to pad |
3mil (0.075mm) |
| 8 |
Minimum hole diameter |
0.10 mm |
| 9 |
Min bonding pad diameter |
10mil |
| 10 |
Max proportion of drilling hole and board thickness |
1:12.5 |
11
|
Finishing Treatment |
HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| 12 |
Solder mask |
Green, White, Red, Yellow, Black, Blue, transparent photosensitive solder mask, Strippable soldermask. |
| 13 |
Minimum thickness of solder mask |
10um |
| 14 |
Color of silk-screen |
White, Black, Yellow etc. |
| 15 |
E-Testing |
100% E-Testing (High Voltage Testing); Flying Probe Testing |
| 16 |
Other test |
ImpedanceTesting,Resistance Testing, Microsection etc., |
| 17 |
Date file format |
GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
| 18 |
Special technological requirement |
Blind Buried Vias and High Thickness copper
|
| 19 |
Thickness of Copper |
0.5-14oz (18-490um) |
| PCB lead time |
|
Layer
|
Quick Turn/Usual Time |
Mass production |
2L |
24hours/ 4-5days |
8-10days |
4L |
48hours/ 6-7days |
10-12days |
6L |
72hours/ 7-8days |
12-14days |
8L |
72hours/ 8-10days |
16-18days |
10L |
96hours/ 12-14days |
18-20days |
PCB Assembly Capability
Minimum IC Pitch |
0.2mm |
Maximum PCB size |
1200x 500mm |
Minimum PCB thickness |
0.25mm |
Minimum chip size: |
0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: |
74x74mm |
BGA ball pitch: |
1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: |
0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: |
0.38mm (minimum), 2.54mm (maximum) |
|
Volume:
|
One piece to low volume production quantities
Low cost first article builds
Schedule deliveries |
Assembly type: |
Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly |
Components type: |
Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch |
Parts procurements: |
Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest |
Solder type: |
Leaded
Lead-free/ROHS complian |
Other capabilities: |
Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection. |
MARKET
 |
With 10 years' development, Cooperation customers up to 500，the main market is in Europe, South America, southeast Asia and Australia.
Under the efforts of the team, we achieved the sales target of 25million ahead of schedule this year
|
SUPPLY CHAIN
 |
With a high-quality development team and professional electronic BOM purchasing supply chain，we focus on reducing customer costs, speeding products to market and helping gain a competitive edge. |
CUSTOMER
Service in a number of well-known enterprises, and received consistent praise.
CERTIFICATION
|
Products
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